Heat management during electrical current flow is a core issue for stamped parts. HAIPART's thermal channel topology optimization technology creates a heat dissipation path within the part, mimicking a vascular network. This cooling system, inspired by biological intelligence, keeps the temperature rise within the ideal range.
Heat management during electrical current flow is a core issue for stamped parts. HAIPART's thermal channel topology optimization technology creates a heat dissipation path within the part, mimicking a vascular network. This cooling system, inspired by biological intelligence, keeps the temperature rise within the ideal range.