Terminal blocks are conductive carriers that achieve multi-circuit current distribution through stamping. HAIPART uses electron migration simulation technology to optimize the conductive path layout, keeping the on-resistance variation of each contact within a microscopically homogeneous range. Surface plasma treatment ensures oxide layer stability.
Terminal blocks are conductive carriers that achieve multi-circuit current distribution through stamping. HAIPART uses electron migration simulation technology to optimize the conductive path layout, keeping the on-resistance variation of each contact within a microscopically homogeneous range. Surface plasma treatment ensures oxide layer stability.
